材料及構件失效分析
● 成分定性分析 Qualitative analysis of composition
● 成分定量分析 Quantitative analysis of composition
● 斷面分析 Cross section analysis
● 腐蝕老化失效分析 Corrosion aging failure analysis
● 磨損斷裂機理分析 Analysis of wear and fracture mechanism
● 異物分析 Foreign matter analysis
● 微觀結構分析
電子元器件失效分析
● 顯微鏡(2D/3D)觀察 Microscope (2d/3d) observation
● 開封 Decap
● 目視檢查 Visual inspection
● 引線鍵合強度 bonding wire strenght
● 取晶粒 Bare die Extraction
● 激光切割 Laser cutting
● 芯片粘結強度 The bonding strength of the chip
● 去金凸塊 De-Gold Bump
● 靜電放電(ESD)測試 Static discharge(ESD)test
● 芯片去層 Delsyer
● 紅墨水試驗 Dye&Pry test
● 探針測試 Probe test
● 背面研磨 Backside Polishing
● FIB-線路修補 FIB-line repair
● LCR測試 LCR test
● 高解析度顯微拍照 High resolution micrograph
● X射線透視 X-Ray
● I-V曲線量測 I-V curve measurement
● 橫截面切片 Cross section slice
● BGA(PCB)&IC電路提圖服務 BGA(PCB)&IC circuit Titus service
● 掃描電鏡應用 SEM/EDS application
● OBIRCH 應用 OBIRCH application
● EMMILC 液晶熱點偵測 EMMILC liquid crystal hot spot detection
● 超聲波掃描分析 C-SAM analysis
● 焊點分析 Solder joint analysis
● 可焊性 Weldability
● 回流焊模擬 Simulation of reflow welding
● 紅外光譜 Infrared spectrum
● 離子污染 Ionic contamination
● 顆粒物清潔度 Cleanliness of particulate matter
● 應變測試 Strain test
● 錫須評估 Tin whisker evaluation